
Samsung’s next Ultra may trade a flatter back for a bigger camera module. Leaker Ice Universe says the Galaxy S27 Ultra’s camera bump will measure 4.69mm, while its display bezels shrink to 1.28mm, according to reports that followed his X post on October 15. Samsung hasn’t confirmed any of it, and the phone isn’t expected until early 2027.
| Measurement | Galaxy S27 Ultra (leak) | Comparison |
| Camera bump | 4.69mm | About 4.5mm on the S26 Ultra; 4.56mm in earlier OnLeaks CAD renders |
| Display bezels | 1.28mm | 1.32mm on the S26 Ultra |
| Chassis thickness | 7.97mm (earlier CAD leak, not from this one) | Not reported |
The bump grows by roughly 0.2mm over the S26 Ultra, depending on whose figure you use for the older phone, and about 0.1mm over the earlier CAD estimate. The bezel change is only 0.04mm by two reports’ numbers. One outlet says it is 0.4mm, but that would put the S26 Ultra’s bezel at 1.68mm, which doesn’t match the 1.32mm figure the other reports give, so treat the smaller change as more likely. Either way, the shifts are fractions of a millimeter and would be hard to notice by eye.
The thicker bump fits earlier leaks of a 200MP ISOCELL HP6 main sensor, which is said to stay in the 1/1.3-inch class but could need a deeper lens module. That link is speculation, since the leak doesn’t say what the extra depth is for. Reports also describe a new housing on the Pro and Ultra that spreads almost across the width of the back, replacing the vertical layout, while the base models may keep the vertical arrangement. A larger battery is also rumored, but nothing connects it to the thicker bump.
None of the reports gives a final overall thickness, and all the new figures come from a single tipster. For a wider picture of the rumored design and specs, see our Galaxy S27 Ultra roundup and the latest case leak showing a two-design split across the lineup.
M Adnan Akram is the founder and lead writer at Phoonomo, covering mobile technology with a primary focus on Apple and the broader smartphone industry, alongside emerging developments in AI. He follows product launches, spec leaks, and industry trends closely to keep readers informed with timely updates.
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