TSMC is on track to begin mass production of its revolutionary 2nm (N2) process node in the second half of 2025, a generational leap that will redefine power efficiency and performance across client computing and data centers.
The transition to N2 is monumental because it marks the end of the long-serving FinFET transistor architecture, replacing it with the Gate-All-Around FET (GAAFET) nanosheet design. This fundamental shift reduces current leakage, resulting in chips that are up to 15% faster or consume up to 30% less power compared to the current 3nm node.
Unsurprisingly, industry heavyweights are scrambling for capacity. Apple has reportedly secured nearly half of TSMC’s initial 2nm wafer output, cementing its plan to use the technology for the upcoming A20 chipset in the iPhone 18 series, anticipated in late 2026. Qualcomm and NVIDIA are also major early adopters.
While the cost per 2nm wafer is rumored to hit $30,000 the dramatic efficiency gains are deemed essential for accelerating on-device AI capabilities and managing the enormous power demands of next-generation data center chips. This node isn’t just about faster clock speeds; it’s about pushing Moore’s Law forward for sustainable, performance-intensive computing.
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