A new report from The New York Times, highlighted by MacRumors, claims that Tim Cook and several top semiconductor executives attended a highly classified U.S. intelligence briefing focused on Taiwan’s strategic risk. The meeting reportedly took place in July 2023 in Silicon Valley at the request of U.S. Commerce Secretary Gina Raimondo.
According to the report, intelligence officials including CIA Director William Burns and Director of National Intelligence Avril Haines warned that China could potentially develop the capability to move against Taiwan by 2027. Executives from major chip companies were present, including Jensen Huang, Lisa Su, and Cristiano Amon (who reportedly joined via video).
The concern centers on global dependence on TSMC, the Taiwanese foundry that produces the majority of advanced chips used in Apple devices and high-end processors from other tech firms. Any disruption in Taiwan could significantly affect supply chains for products like iPhones, iPads, Macs, and AI hardware.
Following the briefing, Cook reportedly remarked that the discussion left him sleeping “with one eye open,” underscoring the seriousness of the risk assessment. U.S. officials are said to be encouraging tech companies to diversify manufacturing and support efforts to expand semiconductor production in the United States.
While the 2027 timeline reflects an intelligence capability assessment rather than a confirmed plan by China, the report highlights growing geopolitical pressure on the global chip ecosystem and why companies heavily reliant on Taiwanese manufacturing are increasingly paying attention.
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