Apple Reportedly Plans iPhone Chip Assembly and Packaging in India for 2026

Apple Reportedly Plans iPhone Chip Assembly and Packaging in India for 2026

Apple is reportedly planning a major expansion of its manufacturing operations in India, with the company exploring chip assembly and packaging for iPhones in the country by 2026. According to recent reports and industry leaks, Apple has entered early-stage discussions with Indian semiconductor firms, signaling a deeper commitment to local production beyond final iPhone assembly.

The talks are said to involve outsourced semiconductor assembly and test (OSAT) partners, with companies like CG Semi which is building a large facility in Gujarat emerging as potential candidates. If finalized, this would mark the first time Apple conducts iPhone chip assembly and packaging in India, although the chips themselves would still be fabricated elsewhere.

Initial production is expected to focus on less complex chips, such as display driver ICs, rather than Apple’s flagship A-series or M-series processors. The move aligns with Apple’s broader strategy to diversify its supply chain away from China and reduce geopolitical and tariff-related risks.

This plan also fits into Apple’s long-term goal of making India a key manufacturing hub, with reports suggesting the company aims to produce a major share of U.S.-bound iPhones in India by the end of 2026. For India, the development could be a significant boost to its growing semiconductor ecosystem, supporting government initiatives aimed at local chip manufacturing and advanced electronics.

That said, the discussions are still described as preliminary, and meeting Apple’s strict quality and scale requirements remains a major challenge for local suppliers. Apple has not officially confirmed the plans, but if they move forward, chip assembly and packaging would represent the next big step in Apple’s India manufacturing roadmap.

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